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solution — SOLUTION

Heat Resistance

Heat Dissipation

Epoxy Resins Copper-clad Laminates SUMILITE^® ELC

Heat Insulation

Heat Insulation

Flame Retardancy/
Uninflammability

Cold Resistance

Strength

Impact Resistance

Dimension Stability

Sliming/Light Weight

Electrical Insulation

Antistatic Property

Carrier tape materials (SUMILITE^® CEL/FSL)

High Adhesiveness

機能から探す/高透明性・高光学特性

High Transparency/
High Optical Property

Chemical Resistance

Gas Barrier Property

Eco-friendliness

Compliant with aircraft interior standards

Topics More

2024/12/26 Products Development of SUMIKON® AM-3800 - a Diallyl Phthalate (DAP) molding compound for high voltage (800V) and high heat resistance
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2024/10/28 Products Completion Ceremony for New plant of Sumitomo Bakelite (Suzhou) Co., Ltd. for Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
2024/10/28 Newsletter [S-BIO Insight] Platform for efficient drug research: application on our new MPS device

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