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Heat Dissipation

Heat Dissipative Materials

We offer various heat dissipative materials such as Phenolic molding compounds, Epoxy molding compounds and Epoxy liquid resin.

Epoxy Resin Copper-clad Laminates SUMILITE® ELC

Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.

Aluminum Based Materials for PCB SUMILITE® ALC

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.


Product information on pastes for die bonding.

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