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Heat Dissipation

Epoxy Resin Copper-clad Laminates SUMILITE® ELC

Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.

Aluminum Based Materials for PCB SUMILITE® ALC

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

SUMIRESIN EXCEL® CRM

Product information on pastes for die bonding.

Heat Dissipation Sheet

Heat Dissipation Sheet

High thermal conductivity for power electronics equipment/Thermosetting resin adhesive sheet with high electrical insulation

Heat Dissipation Sheet for Metal Base Substrates

Heat Dissipation Sheet for Metal Base Substrates

It’s a heat-dissipating insulating sheet that can be used for the insulation layer of metal substrates.

Heat Dissipation Sheet

Heat Dissipation Sheet with Copper Foil

It's a semi-cured sheet compatible with transfer molding.

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