Sumitomo Bakelite Co., Ltd.

High Thermal Conductivity and Insulating Material
Heat Dissipation Sheet with Copper Foil

Product Introduction

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Semi-cured sheet compatible with transfer molding to ensure semiconductor reliability.
It supports the conventional module manufacturing process using our epoxy resin molding materials for semiconductor encapsulation and lead frames. Furthermore, it reduces package warpage compared to ceramic substrates.

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Recommended Molding Conditions for 12W-Glade Sheet Designed for Transfer Molding 

  • After molding with a flat press, post-cure (PMC) is performed in an oven.
  • An example of the temperature/surface pressure profile and PMC conditions is shown below.
  • The recommended molding conditions are just one example and serve as a guideline. Adjustments may be necessary based on factors such as the surface condition of the adhered materials, molding machine, internal temperature data from heat sources, product size, and press timing.
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General Properties 

Heat Dissipation Sheet & Heat Dissipation Sheet with Copper Foil

Item Test method ELS－4211
Thermal conductivity  W/(m·K) Laser Flash 25℃ 14
Dielectric breakdown strength kV AC, 25℃ 12
Volume resistivity  Ω·cm DC, 1kV, 1min, 25℃ 1E+16
Dielectric constant - 1MHz 4.6
Storage modulus Gpa DMA(Tensile) 16
Tg ℃ DMA(Tensile)  220
Coefficient of linear expansion α1 ppm/K TMA(Tensile)  12
Coefficient of linear expansion  α2 ppm/K TMA(Tensile)  42
Copper foil peel strength N/mm 18μm Copper foil 0.3
THB hr 85℃/85%RH/DC1kV >2000

Remark

  • The data given above are not guaranteed values.

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