Sumitomo Bakelite Co., Ltd.

High Thermal Conductivity and Insulating Material
Heat Dissipation Sheet with Copper Foil

Product Introduction

製品写真

Semi-cured sheet compatible with transfer molding to ensure semiconductor reliability.
It supports the conventional module manufacturing process using our epoxy resin molding materials for semiconductor encapsulation and lead frames. Furthermore, it reduces package warpage compared to ceramic substrates.

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Recommended Molding Conditions for 12W-Glade Sheet Designed for Transfer Molding 

  • After molding with a flat press, post-cure (PMC) is performed in an oven.
  • An example of the temperature/surface pressure profile and PMC conditions is shown below.
  • The recommended molding conditions are just one example and serve as a guideline. Adjustments may be necessary based on factors such as the surface condition of the adhered materials, molding machine, internal temperature data from heat sources, product size, and press timing.
製品写真

General Properties 

Heat Dissipation Sheet & Heat Dissipation Sheet with Copper Foil

Item Test Method 12W glade
(200 μm)
Thermal Conductivity W/m·K Laser flash / 25 ˚C 12
Dielectric Breakdown Voltage kVrms AC / 25 ˚C 12
Volume Efficiency Ω·cm DC, 0.5 kV / 25 ˚C 1E+16
Dielectric Constant - 1 MHz 4.6
Dielectric Tangent - 1 MHz ≦0.02
Glass Transition Temperature (Tg) ˚C DMA 220
Elastic Modulus (E’) GPa DMA / 25 ˚C 24
CTE (α1) ppm/K TMA, < Tg 12
Copper Foil Peel Strength kN/m 18 μm Copper foil 0.3

Remark

  • The data given above are not guaranteed values.

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