High Thermal Conductivity and Insulating Material

Heat dissipation sheet
We propose the optimal products with reliable technology and experience.

We have developed a thermosetting resin composite material
with ”high thermal conductivity," "insulation," and "heat resistance."

Features

What is a Heat Dissipation Sheet?

It is a sheet that transfers heat generated from heat sources such as power semiconductors, various devices, and high-power LEDs to cooling parts (heat sinks) while maintaining insulation properties.

It is a thermosetting resin adhesive sheet with high thermal conductivity and high electrical insulation.
It ensures the safety and reliability of power electronics equipment and electronic devices.
It has heat resistance capable of withstanding continuous operation at temperatures above 150°C.

Power module(case type)

Power module (molding type)

2 Strengths of Heat Dissipation Sheet

1	It is an insulating sheet with industry-leading thermal conductivity, optimally blended with highly thermally conductive inorganic fillers in the thickness direction of the sheet. Power module(case type) For more details: Strength① Heat dissipation
2	It achieves low warpage compared to ceramic substrates. It is a superior substrate material in terms of warpage during the semiconductor chip mounting process and in power module products. For more details: Strength②Warpage

Product Introduction: Capabilities of Heat Dissipation Sheets

We propose high-quality products and processing methods tailored to our customers' needs, utilizing the experience and technology we have built up over the years.