MobilityElectrification
High heat resistance and high insulation thermosetting resin
improves functionality and reliability of electric power train.
- TOP
- Electrification
- High Thermally Conductive Insulation (Sheets/Metal-Based Substrate Materials)
High Thermally Conductive Insulation
(Sheets/Metal-Based Substrate Materials)
Metal Base Substrate (7W/3W)
| Test Items | Conditions | Unit | ALC-1371 (120µm) |
ALC-1331 (80µm) |
| Thermal Conductivity(LF) | A | W/m·K | 7 | 3 |
| Breakdown Voltage DC | A | kV | >10 | >10 |
| Breakdown Voltage AC | A | kV | 6 | 6 |
| Peel Strength (35μm) | A | N/mm | 1.7 | 1.5 |
| Flammability | UL94(A) | - | 94V-0 | 94V-0 |
| Tracking Resistance | A (IEC method) |
V | 600 | 600 |
| Tg | TMA | deg.C | 130 | 100 |
| Young’s Modulus | A | GPa | 40 | 21 |
| Water Absorption | D-24/23 | % | 0.3 | 0.3 |
| Chemical Resistance | 3%NeOH 40deg.C 3min |
- | OK | OK |
|---|
* These are representative values, not specification.
High Thermal Conductivity Insulating Sheet (12W)
This Material Realizes Heat Dissipation and Insulation Properties at the Same Level as Ceramic with an Organic Material
12W/m·K PCB
Alternative to DBC board
Standard Structure
| Property | Conditions | New Grade | |
| Thermal Conductivity | w/m·K | Laser Flash/25℃ | >12 |
|---|---|---|---|
| w/m·K | Laser Flash/175℃ | >10 | |
| Breakdown Voltage | kVrms | AC, 100um@25℃ | >6 |
| Thermal Conductivity | Ω·cm | DM, 1kV, 1min@25℃ | 1015 |
| Ω·cm | DM, 1kV, 1min@175℃ | 1013 | |
| Dielectric Constant | ー | 1MHz | 4.6 |
| Tg | ℃ | TMA, 10℃/min | >200 |
* These are representative values, not specification.
Application examples
