Product Introduction
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We propose optimal processing methods based on our accumulated knowledge and technology. Please feel free to consult with us. |
Compared to ceramic substrates, resin substrates exhibit less warpage, simplifying power module design,
chip mounting, and assembly.
This enables the realization of compact, lightweight power modules with high insulation reliability and
excellent heat dissipation.
General properties
Heat Dissipation Sheet for Insulated Metal Substrates (IMS)
| Item | Test method | 12W -glade CLC-5201 (175μm) |
18W glade (Under development) (150μm) |
|
|---|---|---|---|---|
| Thermal conductivity | W/m·K | Laser flash / 25℃ | >12 | >17 |
| W/m·K | Laser flash / 175℃ | >10 | >15 | |
| Dielectric breakdown strength | kVrms | AC / 25℃ | >8 | >8 |
| Volume resistivity | Ω·cm | DC, 1 kV, 1 min / 25℃ | 1E+16 | 1E+16 |
| Ω·cm | DC, 1 kV, 1 min / 175℃ | 1E+13 | 1E+13 | |
| Dielectric constant | - | 1 MHz | 4.6 | 4.5 |
| Dielectric loss tangent | - | 1 MHz | 0.005 | 0.007 |
| Glass transition temperature (Tg) | ℃ | TMA | >200 | 220 |
| Modulus of elasticity (E’) | GPa | DMA / 25℃ | 24 | 18 |
| CTE (α1) | ppm/K | TMA, < Tg | 11 | 11 |
| CTE (α2) | ppm/K | TMA, > Tg | 31 | 45 |
| Shear bond strength | MPa | Die shear | >10 | >10 |
Remark
- The data given above are not guaranteed values.
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