Sumitomo Bakelite Co., Ltd.

2026
SEMICON TAIWAN 2026

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SEMICON TAIWAN 2026

Dates: September 2 to 4
Location: Taipei Nangang Exhibition Center　T9512

Sumitomo Bakelite Co., Ltd. will be exhibiting for the first time at SEMICON TAIWAN, to be held at the Taipei Nangang Exhibition Center from September 2 to 4, 2026.
To address the various challenges in semiconductor packaging technology, which underpins the increasingly rapid development of AI data centers and physical AI technologies, we offer a range of functional resin materials that significantly contribute to power efficiency, thermal management, high reliability, and improved processability.
We look forward to seeing you at our booth.

Highlight

Our products supporting the evolution of AI

  • Compression molding encapsulation resins (granule/liquid) for WLP/PLP
    “SUMIKON™ EME Version GR”“SUMIKON™ EME-L series”
  • Bonding materials (TIM) with excellent heat dissipation and stress resistance
    “SUMIRESIN EXCEL™ CRM”
  • Photosensitive resin with excellent low-temperature curing properties and adhesion for RDL
    “SUMIRESIN EXCEL™ CRC”
  • Build-up film materials for organic/glass cores
    “SUMILITE™ LAZ”
  • High-thermal-conductivity encapsulation resin with excellent heat dissipation and reliability
    “SUMIKON™ EME”
  • Dicing tape material for SiC cutting with transparency and heat resistance
    “SUMILITE™ FSL”
  • Cover tape material with high-strength and excellent mounting stability
    “SUMILITE™ CSL-Z”

Power products that contribute to energy savings

  • Liquid encapsulation resin for enclosures with high heat resistance and high reliability
    “SUMIMAC™ ECR”
  • Insulating heat-dissipation sheet material with high thermal conductivity and reduced warpage as a ceramic alternative
    “SUMILITE™ BLA”
  • Bonding materials with excellent reliability and thermal conductivity for large-area cooling unit
    “SUMIRESIN EXCEL™ CRM”

New products expand into a wide range of fields

  • “COPLUS™” is currently being explored for a wide range of applications—including as a dispersant or additive in formulations, as well as for coatings and structural applications on its own—in fields such as electronic materials, displays, industrial equipment, and medical devices.
  • A flexible optical circuit film featuring low light propagation loss and minimal crosstalk, made using our proprietary polymer material and manufacturing process
    “Polymer Optical Waveguides & Materials”

Division list

  •  Global Marketing Division
  •  Power Electronics Solution Development Department

Related Information

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