Heat Dissipation for Thin High-Thermal-Conductivity Power Module Adaptation -Concept-
Conventional Structure (Ceramic Structure)
Proposed Structure (Heat Dissipation Sheet)
| Existing Structure Module (Ceramic substrate) | Proposed Structure Module (Heat Dissipation Sheet) | |
|---|---|---|
| Thermal Resistance [K/W] | 0.113 | 0.095 |
The Thermal Resistance of the Proposed Structure Module,
Which Applies the Heat Dissipation Sheet and Our Sintering Material, is Low.
Which Applies the Heat Dissipation Sheet and Our Sintering Material, is Low.
Heat Dissipation Properties Using Original Resin with High Thermal Conductivity
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