Difference in Warpage between Resin Substrates and Ceramic Substrates during the Processing stage
Resin Substrate
Process advantages:
Low warpage, no insulation layer cracks, easy cooling device bonding, reduced stress, high reliability
Low warpage, no insulation layer cracks, easy cooling device bonding, reduced stress, high reliability
Ceramic Substrate
Process disadvantages:
The ceramic substrate exhibits significant warpage behavior due to the CTE mismatch between ceramic and copper, causing various problems.
The ceramic substrate exhibits significant warpage behavior due to the CTE mismatch between ceramic and copper, causing various problems.
Heat Dissipation Sheets & Resin Substrates Achieve Process Advantages & High Reliability.
Differences in Warpage Between Resin Substrates and Ceramic Substrates in Power Modules
Resin Substrate Type
〇Results of Non-contact Warpage Measurement
⇒ Deformation is Extremely
Minimal
3D Data
Diagonal Data
Ceramic Substrate Type
〇 Results of Non-contact Warpage Measurement
⇒ Deformation Occurs
with the Heatsink Side Being Convex
3D Data
Diagonal Data
The Warpage Amount of the Resin Substrate in a Package is
Reduced by 80 μm Compared to the Ceramic Substrate.
Reduced by 80 μm Compared to the Ceramic Substrate.
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