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Heat Resistance

Phenolic Resins for Friction Materials

Phenolic resins for friction materials with superior heat resistance and good adhesive performance.

Phenolic Resins for Shell Molding

Phenolic resins for shell molding with high mechanical strength and fast curing performance.

Phenolic Molding Compounds

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Other Thermoset Plastic Molding Compounds

Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)

Long Fiber Reinforced Thermoset Plastic Molding Compounds

Long fibre reinforced thermoset molding composite fills a niche in specialities.

Liquid Epoxy Resin

SUMIMAC® ECR/ECH has excellent workability and safety and is widely used for electrical insulation of ignition coils, relays, sensors and capacitor applications.

Epoxy Coating Powder

SUMILITERESIN® ECP is epoxy resin-based coating powder and has excellent reliability, workability and safety with good adhesive strength, heat resistance, electrical insulation and high mechanical strength.

Heat Dissipative Materials

We offer various heat dissipative materials such as phenolic molding compounds, epoxy molding compounds and epoxy liquid resin.


Co-extruded multilayered films and sheets for industrial uses.

Aluminum Based Materials for PCB SUMILITE® ALC

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.


Product Information on coating resins for semiconductor wafers.

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