Typical process flow of transfer molding
Encapsulation by Epoxy Molding Compound
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【Molding process】
Compression moldingTypical process flow of compression molding
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【Functionalized molding compound】
Laser direct structuring on molded surfacePlating on mold surface
Adhesive
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【Product introduction】
Die attach paste for semiconductorTypical process flow of die attach paste
Photo Imageable Dielectric Material
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【Product introduction】
Introduction of wafer buffer coat and RDLTypical process flow of photo imageable dielectric material
