Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
SUMIKON® EME

Products

Sumitomo Bakelite Co., Ltd. is serving the IC encapsulating material market as the top supplier in the world. Since 1971, with our continuous efforts towards technological innovations, we have played the leading role in the industry. Our integrated manufacturing system composed of 4 plants in 4 countries and regions (i.e. Kyushu, Singapore, China, Taiwan) facilitates smoother delivery of our products to clients throughout the world. We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.

Plants

  • Kyushu Sumitomo Bakelite Co., Ltd.
  • Sumitomo Bakelite Singapore Pte. Ltd.
  • Sumitomo Bakelite (Suzhou) Co., Ltd.
  • Sumitomo Bakelite (Taiwan) Co., Ltd.

Laboratory

  • Information & Telecommunication materials research Laboratory (Japan)
  • Information & Telecommunication materials research Laboratory (Taiwan)
  • Information & Telecommunication materials research Laboratory (China)
  • Information & Telecommunication materials research Laboratory (Singapore)

Features

Environmental friendly

Some SUMIKON EME® series do not use any bromine and antimony flame retardant, and meet UL-94 V-0.

Comparison with conventional products

Applications

Electrical and Electronic Equipment

Semiconductor Encapsulation

Encapsulation material of protection, moisture resistance and insulation for semiconductor devices

Automotive/Railways/Aircraft

Electronic Components

Encapsulation material of protection, moisture resistance and insulation for Electronic modules (ECU), Sensor modules, Power modules

Motors

Motor rotor magnet fixing

Specifications

Line up Advantages Main Applications
EME-E500 series Halogen free/For small pin count device DIS, DIP, SO
EME-E590 series Halogen free/High thermal TO-220F
EME-E630 series Halogen free/Low stress DIP, SO, PLCC, QFP
EME-E670 series Halogen free/Super low stress DIP, SO, Power Module
EME-G500 series Halogen free/For small pin count device DIP, SO, PLCC, QFP
EME-G600 series Halogen free/Standard DIP, SO, PLCC, QFP
EME-G620 series Halogen free/High reliability DIP, SO, PLCC, QFP
EME-G630 series Halogen free/Standard DIP, SO, PLCC, QFP
EME-G700 series Halogen free/High reliability DIP, SO, PLCC, QFP
EME-G750 series Halogen free/For laminate package
Little warpage
BGA/CSP
EME-G760 series Halogen free/For laminate package Standard grade,
High flowability
BGA/CSP
EME-G770 series Halogen free/For laminate package
Improved reliability
BGA/CSP
EME-G790 series Halogen free/Next generation for laminate package
Little warpage, High flowability
BGA/CSP
EME-M100 series Halogen free/Good Formability/High reliability For Electric Part Mounting Circuit Board
EME-M630 series Halogen free/Little warpage/High reliability For Electric Vehicle Motor (IPM) Magnet Fixing

Examples

Lead Frame Package / Area Alley Package

Package appearance

Scale up photo

Electronic Module (Electronic Control Unit, ECU)

SMD Connector Type

Card Edge Type

Motor Rotor Magnet Fixing

Motor Core

Application Image

Exhibitions More

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TEL:
+81-3-5462-4015
FAX:
+81-3-5462-4883

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