Inquiry- TEL:
- +81-3-5462-4015
- FAX:
- +81-3-5462-4883
※9:00-17:40 Mon.-Fri. (JST)
Products
|
Sumitomo Bakelite Co., Ltd. is serving the IC encapsulating material market as the top supplier in the world. Since 1971, with our continuous efforts towards technological innovations, we have played the leading role in the industry. Our integrated manufacturing system composed of 4 plants in 4 countries and regions (i.e. Kyushu, Singapore, China, Taiwan) facilitates smoother delivery of our products to clients throughout the world. We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages. Plants
Laboratory
|
Features
Environmental friendly
Some SUMIKON EME® series do not use any bromine and antimony flame retardant, and meet UL-94 V-0.
Comparison with conventional products
Applications
Electrical and Electronic Equipment
Semiconductor Encapsulation
Encapsulation material of protection, moisture resistance and insulation for semiconductor devices
Automotive/Railways/Aircraft
Electronic Components
Encapsulation material of protection, moisture resistance and insulation for Electronic modules (ECU), Sensor modules, Power modules
Motors
Motor rotor magnet fixing
Specifications
| Line up | Advantages | Main Applications |
|---|---|---|
| EME-E500 series | Halogen free/For small pin count device | DIS, DIP, SO |
| EME-E590 series | Halogen free/High thermal | TO-220F |
| EME-E630 series | Halogen free/Low stress | DIP, SO, PLCC, QFP |
| EME-E670 series | Halogen free/Super low stress | DIP, SO, Power Module |
| EME-G500 series | Halogen free/For small pin count device | DIP, SO, PLCC, QFP |
| EME-G600 series | Halogen free/Standard | DIP, SO, PLCC, QFP |
| EME-G620 series | Halogen free/High reliability | DIP, SO, PLCC, QFP |
| EME-G630 series | Halogen free/Standard | DIP, SO, PLCC, QFP |
| EME-G700 series | Halogen free/High reliability | DIP, SO, PLCC, QFP |
| EME-G750 series | Halogen free/For laminate package Little warpage |
BGA/CSP |
| EME-G760 series | Halogen free/For laminate package
Standard grade, High flowability |
BGA/CSP |
| EME-G770 series | Halogen free/For laminate package Improved reliability |
BGA/CSP |
| EME-G790 series | Halogen free/Next generation for laminate package Little warpage, High flowability |
BGA/CSP |
| EME-M100 series | Halogen free/Good Formability/High reliability | For Electric Part Mounting Circuit Board |
| EME-M630 series | Halogen free/Little warpage/High reliability | For Electric Vehicle Motor (IPM) Magnet Fixing |
Examples
Lead Frame Package / Area Alley Package
Package appearance |
Scale up photo |
Electronic Module (Electronic Control Unit, ECU)
SMD Connector Type |
Card Edge Type |
Motor Rotor Magnet Fixing
Motor Core |
Application Image |
Topics More
- 2024/03/13 Products Completion ceremony of the new plant for Encapsulation of Semiconductor Devices at Sumitomo Bakelite (Taiwan) Co., Ltd.
- 2022/09/29 Products Sumitomo Bakelite (Suzhou) Co., Ltd. builds a new plant for Encapsulation of Semiconductor Devices
- 2022/04/14 Products New lineup of Photosensitive Materials for Mini/Micro LED displays
- 2021/10/18 Products Launch of IoT Solution Gallery
Exhibitions More
- 2021/01/11CES 2021
- 2021/01/20CAR-ELE JAPAN 2021
FAQ