Electronic Components
SUMIKON™ EME
We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.
Phenolic Molding Compounds
Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.
Other Thermoset Plastic Molding Compounds
Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)
Liquid Epoxy Resin
Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)
Epoxy Coating Powder
SUMILITERESIN™ ECP is epoxy resin-based coating powder and has excellent reliability, workability and safety with good adhesive strength, heat resistance, electrical insulation and high mechanical strength.
Epoxy Resin Copper-clad
Laminates
SUMILITE™ ELC
Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.
Epoxy Resin Multilayer PWB
Materials
SUMILITE™ ELC
Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.
Aluminum Based Materials for
PCB
SUMILITE™ ALC
High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.
Heat Dissipation Sheet
High thermal conductivity for power electronics equipment/Thermosetting resin adhesive sheet with high electrical insulation
Heat Dissipation Sheet for Metal Base Substrates
It’s a heat-dissipating insulating sheet that can be used for the insulation layer of metal substrates.
Structural Parts
Phenolic Resins for Friction Materials
Phenolic resins for friction materials with superior heat resistance and good adhesive performance.
Phenolic Resins for Shell Molding
Phenolic resins for shell molding with high mechanical strength and fast curing performance.
Phenolic Molding Compounds
Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.
Long Fiber Reinforced Thermoset Plastic Molding Compounds
Long fibre reinforced thermoset molding composite fills a niche in specialities
Tribological (Low Friction) Phenolic Molding Compounds
High heat resistant plastic with excellent Tribological performance and non-melt property
Adhesives
Phenolic Resins for Rubber-based Adhesives
Phenolic resins for rubber-based adhesives (solvent base, latex) to improve mechanical strength and add tackiness.
Interior Decoration Materials
ABS
ABS is a product that provides well balanced properties such as forming, shock resistance and heat resistance.
KD Acrylic-PVC Alloy Plate
KD has many superior properties such as moldability, chemical resistance, and flame retardancy, in addition to excellent impact resistance close to polycarbonate materials.
alumi decola
Aluminium based decorative laminates specially developed for interior decoration of railway vehicle and bus.
Honeycomb Panels
- Prepregs and honeycomb panels comply with FAR 25.853(d) aircraft interior standard
- Engineered panels
Optical Circuit Products (Polymer Waveguide)
Topics More
- 2026/01/30ProductsDevelopment of Biomass PFA Resin-Based Prepreg with Superior Flame Retardancy for Aircraft Interior Materials
- 2026/01/27Newsletter[S-BIO Insight] "Advances in Human Cerebral Cortex Organoid Generation Using PrimeSurface 96 Slit Well Plate"
- 2026/01/19ProductsDevelopment of Industry's Thinnest-Class 0.2mm High-Voltage Insulation Sheet
- 2026/01/15ProductsAdoption of Heat-Dissipating Insulating Sheet in Resin-Insulated Substrate Integrated Power Module
- 2026/01/13ProductsSustainability Topics: Launch of the Website Towards the Sustainability of Phenolic Resins




























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