Sealed on carrier tape for semiconductors and electrical components packing for SMT process

This tape is suitable for high-speed sealing and provides sufficient peel-off strength even with a short sealing time, and is resistant to tearing even with 4mm width carrier tape (cover tape width: 2.6mm).

Phenolic resins for friction materials with superior heat resistance and good adhesive performance

Phenolic resins for reinforcing rubber products, improving vulcanization and formability

Long fibre reinforced thermoset molding composite fills a niche in specialities

Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)

Long fibre reinforced thermoset molding composite fills a niche in specialities

Suitable for switches, volumes, terminal boards, distributor boards, jigs, insulation plates for molds and dies

Halogen free and environment friendly core material with excellent material properties such as low CTE, high TG and high modulus

Halogen free and environment friendly prepreg material with excellent material properties such as low CTE, high TG and high modulus