Substrate Materials for Semiconductor Packages Prepreg Material

Products

Information of Substrate Materials for Semiconductor Packages

Factory

Utsunomiya Plant

Features

Higher reliability, better warpage control and thinner thickness. Material performance required for recent substrates and PCBs can be achieved by LαZ^® which has excellent material property such as low CTE, high TG and high modulus.

Applications

Electronic Circuit

Package substrate, etc.

For applications that require higher reliability, better warpage control and thinner thickness board for package substrates.

Specifications

Item		Unit	Grade
Item		Unit	LAZ-6785TT-R	LAZ-6785GT-R	LAZ-6785TS-J	LAZ-6785GS-J	LAZ-6785TS-FG	LAZ-6785GS-FG
Glass Cloth Type		-	Low CTE	Normal	Low CTE	Normal	Low CTE	Normal
Prepreg Thickness (before lamination, original PP itself)		um	30	30	30	30	30	30
CTE1 xy		ppm/°C	9	10	11	13	12	14
TG [by DMA]		°C	210	210	260	260	240	240
Tensile Modulus	@30°C	GPa	22	20	16	15	18	16
Tensile Modulus	@250°C	GPa	9	8	9	7	8	7
Dielectric Constant (1GHz)		-	3.9	4.1	3.7	4.0	3.7	3.8
Dissipation Factor (1GHz)		-	0.008	0.007	0.01	0.009	0.01	0.008
Peel Strength (12um VLP)		kN/m	0.9	0.9	0.8	0.8	0.8	0.8
Water Absorption (PCT-2hrs/121°C)		wt%	0.8	0.8	0.4	0.4	0.3	0.3