MobilityAD/ADAS
In the connected and AD/ADAS fields, it supports the enhancement of
sensing functions and high-speed communication from the material aspect.
Innovative Interposer Material for Semiconductor Package “LαZ®”
Advantage
- High Modulusus & Stiffness
- High Heat Resistance
- High Tg
- Halogen Free
- Low Ionic Impurity
- High Reflectance
- Low CTE
- Low Transmittance
Copper Clad Laminate
Small Variation of Dimension Stability & Thickness Control for high precision Substrate
Prepreg
High Modulus & Low CTE to improve PKG Warpage.
High Stiffness SR/ Thin Build Up Material
- High Stiffness for easy handling of thin substrate even without GC.
- High reliability by high Tg & heat resistance & insulation for wide range applications.
Materials for Optical Device
(White/Black core & Black SR)
- High reflectance white core. Effective to substrate with Mini-LED.
- Low transmittance black material. Effective to prevent malfunction by shielding noises.
Low Dielectric Property Materials for 5G
High Modulus and Low CTE with low dielectric property which is required to 5G communication
Core technology
Process
High Heat Resistance, Stiffness Resin and Filler Loading Technology
Conventional Process
- Large Variation of Heat profile by location
Roll to Roll Process
- Uniformed Heat Profile
- Thickness Control
Application examples
Application Processor, Memory, Sensors
