Features

LαZ series is a substrate material with low CTE, high elastic modulus, and high reliability.

Summary

Core materials provided by Sumitomo Bakelite (LAZ-4785 series)

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Application

IC Chip Bonding Electronics & Electrical

For applications requiring high reliability and thinness, such as semiconductor package substrates and module substrates, as well as for bonding a wide variety of various components

Production plant

• Ustunomiya Plant

Other semiconductor package substrate materials

Substrate Materials for Semiconductor Packages
Prepreg Material

Substrate Materials for Semiconductor Packages
Solder resist alternative materials

Related information

Sumitomo Bakelite's Solution

Substrate Materials with High Reflectance/Low Transmittance

Innovative Interposer Material for Semiconductor Package “LαZ™ ”