Features

Low thermal expansion, low dimensional change, high Tg, and high heat resistance enable us to meet the requirements for high reliability, low profile, and high density mounting of packages.

Summary

Prepreg materials provided by Sumitomo Bakelite (LAZ-6785 series)

+Open enlarged image

Application

Electrical and Electronic Equipment

Applications requiring high reliability and thinness, such as semiconductor package substrates and module substrates

Production plant

• Ustunomiya Plant

Other semiconductor package substrate materials

Substrate Materials for Semiconductor Packages
Core Material

Substrate Materials for Semiconductor Packages
Solder resist alternative materials

Related information

Sumitomo Bakelite's Solution

Substrate Materials with High Reflectance/Low Transmittance

Innovative Interposer Material for Semiconductor Package “LαZ™ ”