- 2026/06/01ProductsDevelopment of High-Tg Epoxy Molding Compounds for Next-Generation SiC Power Modules
- 2026/05/18ProductsAnnouncement of Trial Launch of Liquid Encapsulant for Advanced Packages
- 2026/05/15ProductsParticipation in “ECTC 2026”
- 2026/05/14ProductsPrice Revision of Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices SUMIKON™ EMEs






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