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Heat Resistance

Phenolic resins for friction materials with superior heat resistance and good adhesive performance.

Phenolic resins for shell molding with high mechanical strength and fast curing performance.

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)

Long fibre reinforced thermoset molding composite fills a niche in specialities.

SUMIMAC^® ECR/ECH has excellent workability and safety and is widely used for electrical insulation of ignition coils, relays, sensors and capacitor applications.

SUMILITERESIN^® ECP is epoxy resin-based coating powder and has excellent reliability, workability and safety with good adhesive strength, heat resistance, electrical insulation and high mechanical strength.

We offer various heat dissipative materials such as phenolic molding compounds, epoxy molding compounds and epoxy liquid resin.

Co-extruded multilayered films and sheets for industrial uses.

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

Product Information on coating resins for semiconductor wafers.