Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.
Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.
Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.
Phenolic resin copper-clad laminates produced by stringent quality assurance system.
High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.
Suitable for switches, volumes, terminal boards, distributor boards, jigs, insulation plates for molds and dies.
Halogen free and environment friendly core material with excellent material properties such as low CTE, high TG and high modulus.
Halogen free and environment friendly prepreg material with excellent material properties such as low CTE, high TG and high modulus.
Product information on epoxy resin molding compounds for encapsulation of semiconductor devices.