Search by Function
Flame Retardancy/Uninflammability

Phenolic Molding Compounds

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Epoxy Resin Copper-clad Laminates SUMILITE®ELC

Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.

Epoxy Resin Multilayer PWB Materials SUMILITE®ELC

Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.

Phenolic Resin Copper-clad Laminates SUMILITE®PLC

Phenolic resin copper-clad laminates produced by stringent quality assurance system.

Aluminum Based Materials for PCB SUMILITE®ALC

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

Unclad Laminates SUMILITE®PL/EL

Suitable for switches, volumes, terminal boards, distributor boards, jigs, insulation plates for molds and dies.

Core Material 4785GS Series

Halogen free and environment friendly core material with excellent material properties such as low CTE, high TG and high modulus.

Prepreg Material 6785GS Series

Halogen free and environment friendly prepreg material with excellent material properties such as low CTE, high TG and high modulus.

SUMIKON®EME

Product information on epoxy resin molding compounds for encapsulation of semiconductor devices.

Exhibitions More

Call or email us about our Division/Department.

Please take a look at the FAQ first.