Pioneer in plastics
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We offer various heat dissipative materials such as PPS molding compounds, Phenolic molding compounds, Epoxy molding compounds and Epoxy liquid resin.
Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.
High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.
Product information on pastes for die bonding.
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