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2016
Publicized Technologies

  • Chemical surface modification of aluminum oxide nanoparticles with graft copolymer of aluminum oxide and poly(isobutyl vinyl ether) mechanochemically synthesized in vacuum at low temperature
    Advanced Powder Technology (December 13-16, 2016)

  • Fractural Mechanism of Long Fiber Reinforced Phenolic Molding Compound
    The 11th SPSJ International Polymer Conference (IPC 2016) (December 13, 2016)

  • Development of Manufacturing Process for Biomass-Derived Phenol
    The 11th SPSJ International Polymer Conference (IPC2016) (December 13, 2016)

  • Potential Differentiation Marker (DNA & Glycan) Evaluating kit for bone and cartilage.
    Regenerative Medicine Japan (December 13, 2016)

  • Innovative material development for Power device
    ICCAD2016 (December 12, 2016)

  • Graded Index Polymer Waveguide for High-Bandwidth Optical Circuit
    IEEE CPMT Symposium Japan 2016 (November 7-9, 2016)

  • Cross-link inhomogeneity in phenolic resins at the initial stage of curing studied by 1H-pulse NMR spectroscopy and complementary S/WAXS and SANS/WANS with a solvent-swelling technique
    Polymer, vol.103, pp.152-162 (October 26, 2016)

  • Large-scale molecular dynamics simulation of crosslinked phenolic resins using pseudo-reaction model
    Polymer, vol.103, pp.261-276 (October 26, 2016)

  • ACGG 2016 Technical Seminar
    8th Asian Community of Glycoscience & Glycotechnology (ACGG) Annual Conference (October 15, 2016)

  • Potential Differentiation Marker (DNA & Glycan) Evaluating kit for bone and cartilage.
    Regenerative Medicine Japan (October 13, 2016)

  • Innovative material development for Power device
    ICCAD2016 (October 12, 2016)

  • Delamination toughness between encapsulation resin and substrate for power devices at high temperature
    IEMT-EMAP 2016 (September 20, 2016)

  • Novel ESD-suppressing material: Voltage-dependent resistor (VDR) resin with ZnO-based ceramic fillers
    IEEE-ESTC 2016 conference (September 3, 2016)

  • Polymer Waveguide and it's Applications
    Phoxtrot Presentation (August 1, 2016)

  • Decapsulation of Copper Wire Devices with Highest Tg Mold Compound Using Microwave Induced Plasma
    IPFA2016 (July 16, 2016)

  • Introduction of S-BIO's Glycan-related products for precise and high-throughput glycomic analysis
    2016 KHUPO (July 1, 2016)

  • Development of Rapid and Simple kit for IgG Glycan Preparation
    5th European Biosimilars Congress 2016 (June 27, 2016)

  • The Advantage of Hard Carbon for Cold Cranking & Rapid Charging Requirement (April 29, 2016)

  • Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging
    2016 Materials Reseach Society (MRS) Spring Meeting & Exhibit(March 31, 2016)

  • Epoxy Molding Compound for FOWLP
    2016 MRS (Materials Research Society) Spring Meeting & Exhibit(March 30, 2016)

  • Study of epoxy molding compound for fingerprint sensor
    2016 China Semiconductor Technology International Conference (CSTIC) (March 13, 2016)

  • New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
    Materials for Advanced Packaging, 2nd Edition (Springer)

  • Peroxy radicals as motional probes at the end of isolated polystyrene chains and on the cellulose surfaces in vacuum
    Cellulose (February 2, 2016)

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