Heat Dissipative Materials

Products

We offer heat dissipative materials like thermoset molding compounds (phenolic and epoxy), liquid resin (epoxy) and powder coating resin (epoxy), to meet thermal management requirement in various applications.

Plant

  • Shizuoka Plant

Laboratories

  • High Performance Plastic Technology Development Laboratory

Features

Wide range products line-up

Our heat dissipative molding compounds are based on thermoset plastics or thermoplastics with 1-10W/m·K.

Applications

Electrical and Electronic Equipment

Electronic Components

Automotive/Railways/Aircraft

Electronic Components

Automotive parts

Motor, battery, automotive electrical components

Specifications

Heat Dissipative Thermoset Molding Compounds

Electrical insulative grade, SUMIKON®PM Series
ItemTest methodUnitPM-TX110PM-TX115PM-TX130Reference
PM-9630
PhenolicPhenolicPhenolicPhenolic
Heat conductivityProbeW/m·K11.530.3
Laser flash-1.82.4-
Specific gravityASTM D792-2.112.442.741.81
Flexural strengthASTM D790MPa15011540200
Flexural modulusASTM D790GPa2019916
Izod impact strengthASTM D256J/m3.3325.1
Deflection temperature under loadASTM D648°C260260260-
Volume resistivitySB methodΩ·cm-106106

Remark

  • TX110, TX115, TX130: under development.
  • The data given above are not guaranteed values.

Exhibitions More