Encapsulations for various types of semiconductor packages
Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.
Excellent molded parts molding dies with high precision made of thermoplastic engineering plastic compounds.
Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.
Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.
Super engineering plastics films, SUMILITE®FS has various property such as heat resistance and resistance.
Cell Culture Petri Dishes is polystyrene petri dishes that have outstanding adhesiveness, proliferation and chemical specialty
Multi Well Plates provide excellent performance in initial cell adhesion and proliferation via special surface treatment for adhesion cell
Centrifuge Tubes have achieved outstanding transparency and centrifugal strength.
Cryogenic Vials store valuable samples such as cell,serum and antibody safely.
Halogen free and environment friendly core material with excellent material properties such as low CTE, high TG and high modulus.
Halogen free and environment friendly prepreg material with excellent material properties such as low CTE, high TG and high modulus.
Product information on pastes for die bonding.