Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
SUMIKON® EME
Product information on epoxy resin molding compounds for encapsulation of semiconductor devices.
Coating Resins for Semiconductor Wafers
Pastes for Die Bonding
Substrate Materials for Semiconductor Packages
Core Material
Halogen free and environment friendly core material with excellent material properties such as low CTE, high TG and high modulus.
Prepreg Material
Halogen free and environment friendly prepreg material with excellent material properties such as low CTE, high TG and high modulus.
Buildup Material
Halogen free and environment friendly build-up material with excellent material properties such as low CTE, high TG and high modulus.
High performance S/R Material
Halogen free and environment friendly S/R Material with excellent material properties such as low CTE, high TG and high modulus.
Topics More
- 2024/03/13 Products Completion ceremony of the new plant for Encapsulation of Semiconductor Devices at Sumitomo Bakelite (Taiwan) Co., Ltd.
- 2022/09/29 Products Sumitomo Bakelite (Suzhou) Co., Ltd. builds a new plant for Encapsulation of Semiconductor Devices
- 2022/04/14 Products New lineup of Photosensitive Materials for Mini/Micro LED displays
- 2021/10/18 Products Launch of IoT Solution Gallery
Exhibitions More
- 2021/01/11CES 2021
- 2021/01/20CAR-ELE JAPAN 2021
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