Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
SUMIKON®EME

Products

Sumitomo Bakelite Co., Ltd. is serving the IC encapsulating material market as the top supplier in the world. Since 1971, with our continuous efforts towards technological innovations, we have played the leading role in the industry. Our integrated manufacturing system composed of 4 plants in 4 countries and regions (i.e. Kyushu, Singapore, China, Taiwan) facilitates smoother delivery of our products to clients throughout the world. We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.

Plants

  • Kyushu Sumitomo Bakelite Co., Ltd.
  • Sumitomo Bakelite Singapore Pte. Ltd.
  • Sumitomo Bakelite (Suzhou) Co., Ltd.
  • Sumitomo Bakelite (Taiwan) Co., Ltd.

Laboratory

  • Electronic Device Materials Research Laboratory (Japan, Singapore, China, Taiwan)

Features

Environmental friendly

Some SUMIKON EME® series do not use any bromine and antimony flame retardant, and meet UL-94 V-0.

Comparison with conventional products

Applications

Electrical and Electronic Equipment

Semiconductor Encapsulation

Encapsulation material of protection, moisture resistance and insulation for semiconductor devices

Automotive/Railways/Aircraft

Electronic Components

Encapsulation material of protection, moisture resistance and insulation for Electronic modules (ECU), Sensor modules, Power modules

Motors

Motor rotor magnet fixing

Specifications

Line upAdvantagesMain Applications
EME-E500 seriesHalogen free/For small pin count deviceDIS, DIP, SO
EME-E590 seriesHalogen free/High thermalTO-220F
EME-E630 seriesHalogen free/Low stressDIP, SO, PLCC, QFP
EME-E670 seriesHalogen free/Super low stressDIP, SO, Power Module
EME-G500 seriesHalogen free/For small pin count deviceDIP, SO, PLCC, QFP
EME-G600 seriesHalogen free/StandardDIP, SO, PLCC, QFP
EME-G620 seriesHalogen free/High reliabilityDIP, SO, PLCC, QFP
EME-G630 seriesHalogen free/StandardDIP, SO, PLCC, QFP
EME-G700 seriesHalogen free/High reliabilityDIP, SO, PLCC, QFP
EME-G750 seriesHalogen free/For laminate package Little warpageBGA/CSP
EME-G760 seriesHalogen free/For laminate package Standard grade, High flowabilityBGA/CSP
EME-G770 seriesHalogen free/For laminate package Improved reliabilityBGA/CSP
EME-G790 seriesHalogen free/Next generation for laminate package Little warpage, High flowability BGA/CSP

Examples

Lead Frame Package / Area Alley Package

Package appearance

Scale up photo

Electronic Module (Electronic Control Unit, ECU)

SMD Connector Type

Card Edge Type

Motor Rotor Magnet Fixing

Motor Core

Application Image

Exhibitions More

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