Pastes for Die Bonding
SUMIRESIN EXCEL®CRM

Products

In the domestic market of die attach pastes, Sumitomo Bakelite Co., Ltd. has kept the leading position with the highest market share while also actively developing overseas markets.
From 2 manufacturing bases, in Japan (Utsunomiya city) and Singapore, we can provide high level and high quality products with an on-time delivery system.
Sumitomo Bakelite Co., Ltd. supplies not only conventional packaging materials but also materials proactively developed for BGAs, CSPs, LED and other advanced packages.

Plants

  • Utsunomiya Plant
  • Sumitomo Bakelite Singapore Pte. Ltd.

Laboratory

  • Electronic Device Materials Research Laboratory (Japan, Singapore)

Features

Higher Reliability

The CRM series are one-component type of die attach pastes with high reliability for all semiconductor packages and LED packages.

Applications

Electrical and Electronic Equipment

Semiconductors

Bonding of IC chips with lead frames and organic substrates, stacking of IC chips.

LED Package

Bonding of LED chips with lead frames and organic substrates.

Specifications

GradeFeaturesMain Applications
CRM-1030 seriesStandard oven cureSOT, DIP, SO, PLCC, QFP
CRM-1060 series

Standard in-line cure

(Rapid cure)

SOT, DIP, SO, PLCC, QFP
CRM-1070 seriesLow stress

DIP, SO, PLCC, QFP,

L/TQFP, TSOP, LF CSP

CRM-1080 series

High adhesion

High conductivity

Little Chip (SOT, LED etc.)
CRM-1100 seriesInsulation

SOT, DIP, SO, PLCC, QFP,

L/TQFP, TSOP, LF CSP

CRM-1200 seriesUltra high conductivityDIP, SO, PLCC, QFP, L/TQFP, TSOP
CRM-1500 seriesCRM for laminate PKGPBGA, FPBGA, FCBGA

Examples

BGA, QFN, LED etc.

Lead frame package

Area alley package

Exhibitions More

Call or email us about our Division/Department.

TEL:
+81-3-5462-4015
FAX:
+81-3-5462-4883

※9:00-17:40 Mon.-Fri. (JST)

Please take a look at the FAQ first.