World leader of encapsulation materials for semicondunctor devices
IT Materials Division

Answers

Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices SUMIKON®EME

Q1.What are the epoxy molding compounds for semiconductor encapsulation?

A.

It is a compound material which uniformly kneads and disperses inorganic filler such as silica, epoxy resins, curing agents.

Q2.What is the curing condition?

A.

About 60 seconds at 175 degrees Celsius. Customizing is also available.

Q3.Is there a high thermal resistance grade?

A.

We offer various grades which possess high thermal resistance and high Tg for the power semiconductors.

Q4.Is there a high thermal conductivity grade?

A.

We offer various grades which possess high thermal conductivity and excellent flow by changing the filler material from silica to alumina or introducing modifying technology of the filler surface.

Q5.Is there MUF (Mold Under-Fill) material?

A.

We offer various grades which control warpage for thinner semiconductor packages such as application processors.

Q6.What is the molding method?

A.

Transfer molding.

Q7.What is the transfer pressure value during transfer molding?

A.

About 10 MPa. Customizing is also available.

Q8.Is there a grade for compression molding?

A.

We offer various granule grades which possess excellent pot life and filling for narrow gaps.

Pastes for Die Bonding SUMIRESIN EXCEL®CRM

Q1.What is die bonding paste?

A.

It is an adhesive material which is used between semiconductor chips and substrates such as lead frames or organic substrates in the semiconductor mounting process. It possesses a lower ionic impurity level and contributes to higher reliability of the semiconductor packages.

Q2.What kinds of die bonding paste exist?

A.

Die bonding pastes are classified as conductive and non-conductive.
Conductive pastes include metal filler such as silver. Non-conductive pastes include inorganic filler such as silica.
We offer various grades to meet customer's requests. Please contact us for more information.

Q3.What is the curing condition?

A.

15 to 60 minutes at 150 to 175 degrees C for the batch method using an oven.
30 to 60 seconds at 200 degrees C for the inline-curing method.
We offer various grades to meet customer's requests. Please contact us for more information.

Q4.What dispensing methods are available?

A.

Air dispensing, stamping, printing, and other methods are available.
Please contact us for more information.

Q5.What is the packing form?

A.

Packing is available in syringes or jars.

Q6.What is the storage condition?

A.

Storage between -15 and -45 degrees Celsius is preferable to keep dispensing ability.

Q7.Is there a grade for solder replacement?

A.

We offer various grades for 260-degree-Celsius reflow processing that possess high thermal conductivity, high adhesion, low stress, etc.

Q8.What are the grades for LED application?

A.

Grades that support the various dispense methods and have both high conductivity and high adhesion.
We also offer various high thermal conductive grades for power semiconductors.

Coating Resins for Semiconductor Wafers SUMIRESIN EXCEL®CRC

Q1.What is the coating resin for semiconductor wafers?

A.

It is a varnish insulation material which includes polymer, photosensitive material, solvent and other material.

Q2.How is it used?

A.

It is applied on the semiconductor wafers using an application method such as the spin-coating method.

Q3.How is it different from a photoresist?

A.

A photoresist is removed from the semiconductor wafer after the development process.
The coating resin for semiconductor wafers remains on the semiconductor wafer as a permanent layer.

Q4.What is the advantage of using the coating resin for semiconductor wafers?

A.

It works as a protecting layer for semiconductor devices providing protection from filler attacks of epoxy molding compounds and from chemical effects by water or impurities.
This coating resin contributes to increasing reliability.
Also, this coating resin can be used as a redistribution insulation layer for some advanced semiconductor packages.

Q5.What kind of light sources are available during the exposure process?

A.

Available light sources (g-line, i-line, Broad Band) vary in grade. Please contact us for more information.

Q6.What developer is available?

A.

Common TMAH aqueous solution is available.

Q7.What is the curing condition?

A.

30 minutes at 320 degrees Celsius (Oxygen concentration: lower than 10 ppm). We also offer low curing temperature grades.

Q8.Which type is more commonly used, the positive type or the negative type?

A.

Currently, the positive type is more commonly used.

Q9.How much fine pattern can it form?

A.

About a 2-um pattern can form at a 5-um thickness after curing.

Q10.What is the packing form?

A.

4L or 1L HDPE bottles are available in the mass production stage.
100 cc HDPE bottles are available for the evaluation stage.

Q11.What is the storage condition?

A.

Storage at -20 degrees Celsius is preferable to keep viscosity.

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