IT Materials Division

SUMIKON® EME has been used for more than 40 years.

Application of semiconductor devices is expanding from computers to automobiles, the medical industry and infrastructure.
IT materials from Sumitomo Bakelite contribute to the improvement of semiconductor devices.

IT Materials Division Products More

Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices

Product information on epoxy resin molding compounds for encapsulation of semiconductor devices.

Coating Resins for Semiconductor Wafers

Product Information on coating resins for semiconductor wafers

Liquid Epoxy Resins for Encapsulation of Semiconductors

Product information on liquid epoxy resins for encapsulation of semiconductor devices

Pastes for Die Bonding

Product information on pastes for die bonding.

FAQ More

Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices

Q1.What is the epoxy molding compounds for semiconductor encapsulation ?


It is a compound material which kneads and disperses inorganic filler such as silica, epoxy resins, curing agents and so on uniformly.

Pastes for Die Bonding

Q2.What is the die bonding paste ?


It is a adhesive material which is used between semiconductor chips and substrates such as lead frame or organic substrate in semiconductor mounting process. It possesses lower ionic impurity level and contributes to higher reliability of the semiconductor packages.

Q3.What kind of the die bonding paste ?


The die bonding pastes are classified in Conductive type and Non-conductive type.Conductive type paste includes metal filler such as Silver. Non-conductive type paste includes inorganic filler such as silica.We have some grades for the customer's requests. Please contact us for more information.

Coating Resins for Semiconductor Wafers

Q4.What is the coating resin for semiconductor wafers ?


It is a varnish type insulation material which includes polymer, photosensitive material, solvent and so on.

Exhibitions More

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