Substrate Materials for Semiconductor Packages Core Material

Products

Information of Substrate Materials for Semiconductor Packages

Factory

Utsunomiya Plant

Features

Higher reliability, better warpage control and thinner thickness. Material performance required for recent substrates and PCBs can be achieved by LαZ^® which has excellent material property such as low CTE, high TG and high modulus.

Applications

Electronic Circuit

Package substrate, etc.

For applications that require higher reliability, better warpage control and thinner thickness boards for package substrates.

Specifications

Item		Unit	Grade
Item		Unit	LAZ-4785TH-M	LAZ-4785TH-JB	LAZ-4785GH-J	LAZ-4785TH-G	LAZ-4785GH-G	ELC-4785TH-B	LAZ-4785GS-BA
Glass Cloth Type		-	Low CTE	Low CTE	Normal	Low CTE	Normal	Low CTE	Normal
CTE1 xy		ppm/°C	1.6	2	5	4	7	6	10
CTE1 z		ppm/°C	12	12	12	12	12	12	16
Tg [by DMA]		ppm/°C	210	280	280	255	255	265	265
Tensile Modulus	@30°C	GPa	35	34	32	32	31	32	29
Tensile Modulus	@250°C	GPa	18	26	21	21	20	21	18
Dielectric Constant (1GHz)		-	4.1	4.3	4.3	4.0	4.2	4.0	4.2
Dissipation Factor (1GHz)		-	0.008	0.007	0.007	0.005	0.005	0.006	0.007
Peel Strength (Cu12um VLP)		kN/m	0.9	0.7	0.7	0.7	0.7	0.7	0.8
Water Absorption (PCT-2hrs/121°C)		wt%	0.4	0.4	0.4	0.4	0.4	0.4	0.4