High-Adhesion Modified Phenolic Resin | Sumitomo Bakelite Co., Ltd.

Product Introduction

High-Adhesion Phenolic Resin Series: Pursuing Adhesion to Various Materials

Modified phenolic resins designed for high adhesion to various materials, including metals and carbon. They combine excellent adhesive strength and heat resistance to achieve high reliability. This page introduces grades specialized for specific materials and applications.
Click the image below to see details for each grade.

Metal High-Adhesion Phenolic Resin PR-56464

Adhesion Mechanism

The triazine structure forms coordination bonds with metal surfaces. This is expected to enhance adhesion strength and reliability in metal composite components.

Resin Properties

Item	PR-56464
Type	Novolak
Shape	Solid
Softing point (℃)	95
Free phenol（%）	<0.1
adhesive agent content（%）	20

Cu Adhesion Evaluation: Phenolic Resin Molding Compound

Curing conditions: Transfer, Mold temperature 175℃, Injection pressure 10 MPa, Curing time 120 sec

The addition of High Metal Adhesion PR-56464 improves adhesion to copper substrates.

Recommended Usage

Compound by mixing with fillers.
Depending on the application, mold at 150℃ for several minutes, then cure at 180-230℃.

High-Adhesion Phenolic Resin for Inorganic Materials PR-56510H

Adhesion Mechanism

Improved heat resistance/moldability of the resin itself & Enhanced adhesion to inorganic materials are both expected to contribute to improved adhesion.

Resin Properties

Item	PR-56510H
Type・Shape	Novolak・Powder
Flow（mm/125℃）	31
Gel time（sec/150℃）	63
Free phenol（%）	<1.0

Composite Material Properties

Flexural Strength

Mixing conditions: 8% phenolic resin, 2% fiber, and 90% various fillers
Molding conditions: 150℃ × 4 minutes
Curing conditions: 200℃ × 3 hours

Both room-temperature strength and post-heat-treatment strength are improved, and enhanced wear resistance of the molded parts can be expected.

Recommended Usage

Compound by mixing with fillers.
Depending on the application, mold at 150℃ for several minutes, then cure at 180-230℃.

Carbon High-Adhesion Phenolic Resin
PR-56091（Solvent-based） PR-56542（Water-based）

Adhesion Mechanism

Cationic π interactions enhance miscibility with carbon materials, improving adhesion and durability.

Resin Properties

Item	PR-56091	PR-56542
Type	Alcohol-based Liquid	Water-based Liquid
Viscosity（mPa・s/25℃）	12	100
Gelation time（Sec/150℃）	270	300
Resin content（%/135℃）	42	40
Fix carbon（%/800℃）	27	16

Carbon Miscibility Evaluation

Evaluation conditions:
Add 50g of resin and 1g of chopped carbon fiber to a 100cc beaker, stir, and visually inspect the dispersion state after leaving it for 1 day.

Recommended Usage

Use as a binder for carbon-based composite materials.
Cure at 150-250℃ or carbonize at approximately 800-1200℃ depending on the application.

Phenolic Resin for Water-based Coating PR-56449

Adhesion Mechanism

Hydrogen bonding with the substrate via hydroxyl groups (-OH) is expected to Improved adhesion, corrosion resistance, and heat resistance.

Resin Properties

Item	PR-56449
Type	Water-based Liquid
Free Phenol（%）	<0.1
Free formaldehyde（%）	<0.1
Viscosity（mPa・s/25℃）	400
Gelation time（Sec/150℃）	68
Resin content（%/135℃）	40

Heat Resistance Evaluation as Coating Additives

Phenolic Resin Addition Study (Left: None, Right: Added)

＜Measurement conditions＞

・The following 3 types of water-based paints were formulated by adding 10% of AQNOA™ PR-56449.
・Coated by10–20 μm thickness using a bar coater on acid-washed steel plates degreased with acetone.
・Cured for 20 minutes in a hot air oven at 150℃.
・After heat treatment for 4 days in 220℃ hot air oven, the following samples were rubbed 30 times with a cloth soaked in acetone.

①Melamine alkyd resin system
Water-based baking paint

Phenolic Resin Addition Study

None Added

②Urethane system water-based paint
　

③Acrylic polymer system
water-based one component reactive paint

The addition of phenolic resin improves the heat resistance of the coating.

Recommended Usage

Add approximately 5-20% to water-based coating.
Bake coating (Heat to 150℃ or higher to thermoset)

High-Adhesion Phenolic Resin for Aramid Fibers PR-56177

Adhesion Mechanism

The enhanced affinity with aramid due to nitrogen-containing structures is expected to improve the durability of composite materials.

Resin Properties

Item	PR-56177
Type	Methanol-based Liquid
Viscosity（mPa・s/25℃）	10
Gelation time（Sec/150℃）	130
Resin content（%/135℃）	45

Evaluation of Adhesion to Aramid Fibers

Microdrop Test

Measure the load required to peel off a drop of resin cured at 190℃ for 30 minutes from an aramid monofilament.

Aramid fiber: Kevlar29 Shearing speed: 5mm/min

Adhesion to aramid fibers is improved.

Recommended Usage

Adjust the resin dilution ratio with an alcohol-based solvent to achieve the target resin coating amount.
After impregnating the substrate, dry and volatilize the solvent at 100℃ or below.
Cure at 150-200℃ for 10-30 minutes.

Phenolic Resin for Steel bonding
PR-56528（Water-based）
PR-56504（Solvent-based）

Adhesion Mechanism

This is phenolic adhesive with high adhesion and toughness due to hydroxyl groups. It can be used as an adhesive with high bonding strength and high heat resistance.

Resin Properties

Item	PR-56528	PR-56504
Type	Water-based Liquid	Methanol-based Liquid
Free phenol（%）	<0.1	5.1
Free formaldehyde（%）	<0.1	0.2
Viscosity（mPa・s/25℃）	250	1000
Gelation time（Sec/150℃）	68	90
Resin content（%/135℃）	32	40