IoTPower Module
Functional Materials
Supporting High-Efficiency
Energy
Conversion
- TOP
- Power Module
High-reliability Liquid Epoxy Resin
High-Tg liquid epoxy material that can be applied to power modules and high heat-resistant automotive components.
High Heat Dissipation Sheet Material / Metal-Based High Heat Dissipation Substrate Material
Contributes to the heat dissipation of devices responsible for ultra-high-speed, large-capacity communication and information processing.
Plating Thermoset Composite Integration Technology (PM-Plamec series)
Metal plating add various characteristics such as electromagnetic wave shields to thermoset compound, and contribute to motorize & lightweighting.
High-Insulation & High-Heat-Resistant Diallyl Phthalate Resin Molding Compound
Combining tracking resistance and heat resistance to meet the needs of higher voltage applications
Molding Compound for Power Modules
We have developped high reliabiity EMC(Epoxy molding compund) which has high heat resistance, heat dissipation and insulation perfomance for power device. We can also provide your PKG design flexiblity and high productivity by transfer molding system.
High Thermal Conductivity Sintering Paste
To meet the needs for high voltage / high current and solder replacement for power devices, we propose low electrical resistance and high thermal conductivity material with resin compounding and sintering technology.
Paste for Heat Sink Large-Area
bonding
(Under Development)
This paste is suitable for large-area bonding, utilizing sintering technology for high heat dissipation and resin filler technology for low elasticity modulus.
Photosensitive Material for Power Devices
Environmentally friendly photosensitive material with high reliability. Capable of thick film processing, it provides the high insulation performance required for power devices.
Molding Compound for Stator Coil Encapsulation
Greatly contribution to the design flexibility and improving the functionality for EV/HEV drive motors.