IoTPower Module
Functional Materials
Supporting High-Efficiency
Energy
Conversion
- TOP
- Power Module
- Special Molding Compound for Power Control Module
Special Molding Compound for Power Control Module
Adopting to Power Control Module Contributes to Further Miniaturization and Lightweight
Advantage
Excellent properties (insulation, heat dissipation, heat resistance, and adhesiveness) contribute to miniaturization and high performance.
High Heat Resistance
Development of SiC / GaN compatible material
| Property | Unit | G720 | G780 | New Grade |
|---|---|---|---|---|
| Status | – | In Mass Production | In Mass Production | Sample |
| Resin system | – | Epoxy | New Epoxy1 | New Epoxy2 |
| Tg | ℃ | 195 | 195 | 240 |
| Weight loss ※250℃/1000hr |
％ | ＞ 2 | ＜ 2 | ＜ 2 |
| Adhesion (Ni) ※Relative value |
– | 1.0 | 1.6 | 1.3 |
| Dielectric strength | kV/mm | 21 | 22 | 22 |
High Heat Dissipation
Develop high thermal conductive mold compound for several packages.
High Reliability
Development of HTRB compatible material
Test PKG:TO-247
I-V curve after HTRB test
High Insulation Resistance
Creeping distance becomes shorter by high CTI
