Heat Dissipation Sheet/Heat Dissipation
Sheet for Insulated Metal Substrates

Providing Highly Reliable, High Thermal Conductivity Materials Through Formulation and Production Technology Combining High Thermal Conductivity Fillers and High-Reliability Resins.

Metal base compatible materials

The Lineup Tailored to Applications, Including Industry-Leading High Thermal Dissipation Grades

Item		Test Method	ALC-1331 (80μm)
Thermal Conductivity	W/m·K	Laser flash / 25℃	3
Dielectric Breakdown Voltage	kV	DC	>10
Dielectric Breakdown Voltage	kV	AC	6
Peel Strength	N/mm	35μm	1.5
Flame Retardancy	-	UL94	94V-0
Glass Transition Temperature	℃	TMA	100
Modulus of Elasticity (E’)	GPa	DMA	21
Tracking Resistance	V	IEC method	600
Absorption Rate	%	D-24/23	0.3
Chemical Resistance	-	3%NeOH 40deg.C 3min	OK

* The above symbols indicate representative values, not guaranteed values.

Copper-based Compatible Materials

Item		Test Method	BLA-6052 (150μm)	BLA-6081 (175μm)
Thermal Conductivity	W/m·K	Laser flash / 25℃ Laser flash / 175̊C	>16 >14	>12 >10
Dielectric Breakdown Voltage	kVrms	AC / 25℃	>8	>8
Volume Resistivity	Ω·cm	DC, 1kV, 1min/25℃ DC, 1kV, 1min/175̊C	1E+16	1E+13
Dielectric Constant	-	1MHz	1E+16	1E+13
Dielectric Tangent	-	1MHz	4.5	4.6
Glass Transition Temperature（Tg）	̊C	TMA	0.005	0.004
Modulus of Elasticity (E’)	GPa	DMA / 25̊C	>200	>200
CTE（α1）	ppm/K	TMA, < Tg	24	18
CTE（α2）	ppm/K	TMA, > Tg	11	12
Shear Bond Strength	MPa	Die shear	31	50

* The above symbols indicate representative values, not guaranteed values.

Application Examples