IoTPower Module
Functional Materials
Supporting High-Efficiency
Energy
Conversion
- TOP
- Power Module
- Heat Dispersible Components (Non DA paste)
Heat Dispersible Components (Non DA paste)
High Thermal Adhesives For Large Area Applications
Advantage
High Thermal Conductivity: Sintering Technology Low Modulus: Low Modulus Filler/Soft Polymer
Chain
⇒The Great Solution at Large Area Adhesion!
| Sheet | Gel | Solder | Developed Material | |
|---|---|---|---|---|
| Thermal Conductivity | × | × | ◎ | ◎(>15 W/mK) |
| Modulus (Reliability) | ○ | ◎ | × | ○(<10MPa) |
| Adhesive Strength | ◎ | ◎ | × | ◎(<200℃) |
| Handling | ◎ | ○ | ○ | ○(25-60mm) |
Core Technology
Line-Up & Applications
Cooling Method
| Standard Semi-Sintering Paste |
Developed Material | |
|---|---|---|
| Sintering Technology | Yes | Yes |
| Low Modulus Filler | ー | Yes |
| Soft Polymer Chain | ー | Yes |
| Thermal | 16W/mK | 17W/mK |
| Modulus at RT | 9.4GPa | 6.6GPa |
Applications
- ・Power IC
- ・Power Module
- ・Heat Sink of The Battery for Automotive
Please fill out and submit the following format to make an inquiry.