Advantage

High Thermal Conductivity: Sintering Technology Low Modulus: Low Modulus Filler/Soft Polymer Chain
⇒The Great Solution at Large Area Adhesion!

	Sheet	Gel	Solder	Developed Material
Thermal Conductivity	×	×	◎	◎(>15 W/mK)
Modulus (Reliability)	○	◎	×	○(<10MPa)
Adhesive Strength	◎	◎	×	◎(<200℃)
Handling	◎	○	○	○(25-60mm)

Core Technology

Line-Up & Applications

Cooling Method

	Standard Semi-Sintering Paste	Developed Material
Sintering Technology	Yes	Yes
Low Modulus Filler	ー	Yes
Soft Polymer Chain	ー	Yes
Thermal	16W/mK	17W/mK
Modulus at RT	9.4GPa	6.6GPa

Applications

• ・Power IC
• ・Power Module
• ・Heat Sink of The Battery for Automotive