IoTPower Module
Functional Materials
Supporting High-Efficiency
Energy
Conversion
- TOP
- Power-module
- High Thermal Conductive Sintering Paste
High Thermal Conductive Sintering Paste
Thermal Conductivity is Enhanced by Sintering Technology.
Advantage
- Sintering And Resin Compounding Technologies Enable Both High Heat Dissipation And High Reliability
- When Replacing Fully Sintering Paste, It Is Possible To Reduce Linear Expansion Difference Stress By Lowering The Bonding Temperature
- The Use Of Sintered Paste Contributes To The Miniaturization Of Sic Power Devices And A Reduction In The Number Of Parts
Core Technology
Establish Unique Sintering Technology with Micro Ag
| Item | Micro Ag | Nano Ag |
|---|---|---|
| Size | 0.5-5μm | 10-100nm |
| Health Impact | Low | High |
| Content of Organic Component | Low | High |
| Agglomeration Risk | Low | High |
| Sintering Effect | Low | High |
[Micro Ag + Sinter-Promoting Technology]
Semi Sintering
Line up
Application Example
Discrete, High Power LED, Power IC Power module(Si IGBT, SiC, GaN)