- Optimum core structural design of the polymer optical waveguides for co-packaging
2024 British and Irish Conference on Optics and Photonics（December 18, 2024） - Inhibition of interlaminar damage in CFRP laminates by inserting non-woven carbon fiber interlaminar
reinforced tissue
Advanced Composite Materials（December 10, 2024） - Crosslink inhomogeneity in epoxy resins cured with a phenolic hardener under organophosphine catalysts
revealed by small-angle X-ray scattering
Polymer Journal（December 4, 2024） - Meter-scale Long Connectorized Paper-like Polymer Waveguide Film for 100 Gbps Board-level Optical
Interconnects Application
Polymers 2024, 16(23), 3350（November 29, 2024） - Material Innovation for Power Module Packaging
From Nano to Micro Power Electronics And Packaging Workshop 2024（November 28, 2024） - e-Motor Performance Improvement Solution with Thermoset Plastics
Auto EV Tech Vision Summit 2024（November 27-28, 2024） - Exploring Advanced Plastic Material Technology in Power Module Advancements
ECPE /European Center for Power Electronics e.V. /Materials Innovations for Advanced Power Packaging（October 9, 2024） - INHIBITION OF INTERLAMINAR DAMAGE IN CFRP LAMINATES BY INSERTING NON-WOVEN CARBON FIBER REINFORCED
LAYERS
South East Asia - Japan Conference on Composite Materials 2024（August 13-15, 2024） - Microphysiological systems for realizing microenvironment that mimics human physiology-functional material
and its standardization applied to microfluidics
Emergent Materials（August 9, 2024） - Novel Low Df Photosensitive Material for Redistribution Layer
The 41st International Conference of Photopolymer Science and Technology（June 25-28, 2024）
- Environment-friendly Epoxy Molding Compounds for Semiconductors and Automotive
iMAPs MiNaPAD2024（June 19-20, 2024）
- Simulating Brownian motion in thermally fluctuating viscoelastic fluids by using the smoothed profile
method
Journal of Computational Physics, 509, 113035 （2024）（April 22, 2024）
- Optimum Core Structural Design of Polymer Optical Waveguides as Edge Coupler for Co-Packaging
Optics Express（March 12-14, 2024）
- The Latest material technology to support power module packaging
CIPS 2024（March 12-14, 2024）
- Polymer waveguides and their applications to optical communications
IEC TC86 JWG9 （March 12, 2024）
- 100 Gbps PAM4 VCSEL-based Transmission over Meter-scale Flexible Multimode Polymer Waveguides for
Board-level Optical Interconnect Applications
OFC2024 （March, 2024）
- Material Innovation Redefining Power Module Packaging
17th European Advanced Technology Workshop on Micropackaging and Thermal management （January 31, 2024）
- Geometry-based cross-linking algorithm for modeling resorcinol resins through united-atom molecular
dynamics simulations
Polymer vol.293, 126677 （2024）.
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