- Enhancing High Temperature Adhesion Performance Via A Renovated Leadframe Surface Treatment
China Semiconductor Technology International Conference (CSTIC) 2020 (June 29 - July 17, 2020) - High Thermal Die-Attach Paste Development for Analog Device 2020
IEEE 70th Electronic Components and Technology Conference (June 3-30, 2020) - Interfacial cross-link inhomogeneity of a phenolic resin on a silica surface as revealed by X-ray and neutron reflection measurements
Macromolecules, vol.53, no.10, pp.4082-4089. (May, 2020) - Diffusion Behavior of Methanol Molecules Confined in Cross-linked Phenolic Resins Studied using Neutron Scattering and Molecular Dynamics Simulations
J-PARC MLF Annual Report 2018　page.4-6 (March 19, 2020)
Exhibitions More
- 2020/01/15CAR ELE JAPAN 2020
Call or email us about Topics.
Inquiry