2021
Publicized Technologies

  • Semiconductor Materials for Advanced Packages
    The 38th International Conference of Photopolymer Science and Technology (ICPST-38) (June 15 - 16, 2021)

  • Energy- and economic-balance estimation of pyrolysis plant for fuel-gas production from plastic waste based on bench-scale plant operations
    Fuel Communications (June, 2021)

  • Latest technology of Epoxy molding compound(EMC) for FO-WLP
    17th INTERNATIONAL CONFERENCE on DEVICE PACKAGING (April 12-15, 2021)

  • Development of EMC for LDS MID that enables high-density 3D semiconductor packages and high-speed signal transmission modules
    14th International Congress MID 2021 (February 11, 2021)

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