- Semiconductor Materials for Advanced Packages
The 38th International Conference of Photopolymer Science and Technology (ICPST-38) (June 15 - 16, 2021) - Energy- and economic-balance estimation of pyrolysis plant for fuel-gas production from plastic waste based on bench-scale plant operations
Fuel Communications (June, 2021) - Latest technology of Epoxy molding compound(EMC) for FO-WLP
17th INTERNATIONAL CONFERENCE on DEVICE PACKAGING (April 12-15, 2021) - Prediction of shear-thickening of particle suspensions in viscoelastic fluids by direct numerical simulation
Journal of Fluid Mechanics (March 1, 2021) - Development of EMC for LDS MID that enables high-density 3D semiconductor packages and high-speed signal transmission modules
14th International Congress MID 2021 (February 11, 2021)
Exhibitions More
- 2020/01/15CAR ELE JAPAN 2020
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