Q1. Thickness control is difficult due to substrates becoming thinner.
- Our unique production method can minimize "thickness variation", "dimension change", "panel warpage variation" of material contributing to the control of thickness variation of packages.
Q2. Supply for S-glass is unstable
- We can produce low CTE(5ppm) core material using standard E-glass, which can be stably supplied, for CTE areas that use S-glass manufactured by other companies. Also, by using E-glass, costs can be reduced.
Q3. Substrate thickness is thinner which leads to substrates bending making transport difficult.
- We can offer high-rigidity resin and S/R replacement material to improve rigidity.
Q4. Warpage is different depending on the substrate strip area
- Our unique production method can minimize panel warpage variation.
Q5. For memory devices, coreless substrate thickness is becoming thinner and there is concern about insulation reliability due to contact between the glass cloth and circuit.
- We can apply two different resin thicknesses for the top resin layer and bottom resin layer (Asymmetric Prepreg) to avoid contact between the glass cloth and circuit.