Q1. Thickness control is difficult due to substrates becoming thinner.
- Our unique production method can minimize "thickness variation", "dimension change", "panel warpage variation" of material contributing to the control of thickness variation of packages.
Q2. Supply for S-glass is unstable
- We can produce low CTE(5ppm) core material using standard E-glass, which can be stably supplied, for CTE areas that use S-glass manufactured by other companies. Also, by using E-glass, costs can be reduced.
Q3. Material selection for substrate evaluation is difficult.
- We can propose the best material combination using our simulation data and actual PKG evaluation data based on your target PKG structure.
Q4. There is concern with fine L/S in regard to adhesion between the circuit and build-up material.
- Trench technology can solve adhesion concerns and we can provide materials that use this technology.