- Introduction of latest material technology of epoxy molding compound and die attach sintering paste for power module, and new concept of next generation e-Axle
From Nano to Macro Power Electronics and Packaging European Workshop (IMAPS-France)（November 25, 2021） - In situ neutron reflectometry analysis of interfacial structure formation between phenolic resin and silica during curing
Langmuir, 37, 13867-13872 (2021).（November 16, 2021） - Material Solution Introduction for e-Axle
Charged Electric Vehicle Magazine「October 2021 Conference Sessions」（October 18-21, 2021） - Latest technology of wafer coating material for advanced packages
54th International Symposium on Microelectronics(IMAPS) (October 11-14) - Phenolic Resin for Refractories
Journal of the Technical Association of Refractories, Japan (TAIKABUTSU OVERSES) (September 30, 2021) - The effect of yielding of dense silica slurry on the uniformity of coated layer
Journal of Coatings Technology and Research (July, 2021) - Semiconductor Materials for Advanced Packages
The 38th International Conference of Photopolymer Science and Technology (ICPST-38) (June 15 - 16, 2021) - Feature of EZGlyco O-Glycan Prep Kit and high sensitive analysis of O-glycans using Procaiamide in HPLC and MS analysis
NIH & FDA Glycoscience Research Day 2021 Virtual Meeting (June 1, 2021) - Energy- and economic-balance estimation of pyrolysis plant for fuel-gas production from plastic waste based on bench-scale plant operations
Fuel Communications (June, 2021) - Latest technology of Epoxy molding compound(EMC) for FO-WLP
17th INTERNATIONAL CONFERENCE on DEVICE PACKAGING (April 12-15, 2021) - Prediction of shear-thickening of particle suspensions in viscoelastic fluids by direct numerical simulation
Journal of Fluid Mechanics (March 1, 2021) - Development of EMC for LDS MID that enables high-density 3D semiconductor packages and high-speed signal transmission modules
14th International Congress MID 2021 (February 11, 2021)
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