- Rheological evaluation of particle suspensions in viscoelastic fluids using the smoothed profile method
18th International Congress on Rheology (December 17, 2020) - Time-domain microrheological evaluation of colloidal suspensions
18th International Congress on Rheology (December 17, 2020) - Latest technology of Epoxy molding compound(EMC) for FO-WLP
53rd INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS (October 6, 2020) - Effect of shear flow on the uniformity of coated film of multi modal silica particle slurry
20th International Coating Science and Technology Symposium (September 20-23, 2020) - Performance study of a PMSM with molded stator and composite housing With internal slot cooling – resulting in high continuous power
3rd International Conference eDrive (June 24, 2020) - Enhancing High Temperature Adhesion Performance Via A Renovated Leadframe Surface Treatment
China Semiconductor Technology International Conference (CSTIC) 2020 (June 29 - July 17, 2020) - High Thermal Die-Attach Paste Development for Analog Device 2020
IEEE 70th Electronic Components and Technology Conference (June 3-30, 2020) - Interfacial cross-link inhomogeneity of a phenolic resin on a silica surface as revealed by X-ray and neutron reflection measurements
Macromolecules, vol.53, no.10, pp.4082-4089. (May, 2020) - Diffusion Behavior of Methanol Molecules Confined in Cross-linked Phenolic Resins Studied using Neutron Scattering and Molecular Dynamics Simulations
J-PARC MLF Annual Report 2018 page.4-6 (March 19, 2020)
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- 2020/01/15CAR ELE JAPAN 2020
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