Epoxy Molding Compounds for Semiconductors
We have cultivated the advanced technologies for Epoxy Molding Compound (EMC) over many years, and our
EMC products have been used widely across many industries.
In order to support our customers to
achieve lead-free packaging technology and highly reliable performance in high-temperature applications,
we have developed environment-friendly products across all EMC grades by adopting non-halogen
technology.
Products
Technical Information
High Thermal Conductive Encapsulant Supporting High-Speed Semiconductor Devices
Epoxy Encapsulation Materials for Semiconductors Package List 1
| QFP | QFN | SOP | DIP | SIP ZIP* | Discrete | Module | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Large | Small | Thin Large | Thick | Small | Thin | Small | Power | SMD | Photo- Coup. | Power | General | ||||
| KE-G3000 | ☆ | ☆ | ☆ | ☆ | ☆ | ☆ | ☆ | ☆ | |||||||
Epoxy Encapsulation Materials for Semiconductors Package List 2
| P-BGA | F-BGA | Module | |||||
|---|---|---|---|---|---|---|---|
| Single | MAP* | Flip Chip | MAP* | Flip Chip | Power | General | |
| KE-G1250AH (Compression Molding) |
☆ | ☆ | ☆ | ☆ | ○ | ||
| KE-G1250DS | ☆ | ☆ | |||||
| KE-G1250FC | ☆ | ☆ | |||||
| KE-G1250LKDS | ☆ | ☆ | |||||
| KE-G1250TC | ☆ | ☆ | |||||
| KE-G1250HT (High Thermal Conductivity) |
☆ | ☆ | ☆ | ||||
| KE-G1270 | ☆ | ☆ | |||||
☆: Recommended ○: Applicable
*ZIP = Zigzag Inline Package
All grades listed in the table are Br/Sb free.
*Please contact us if UL certification such as flame retardancy is required.