Epoxy Molding Compounds for SemiconductorsEMC for Lead Frame Package
Excellent reflow performance through high adhesive strength
Features
- High adhesive strength to avoid the delamination by reflow
- Excellent high temperature storage performance
- Lineups applicable for various frames, such as Copper, 42Alloy and Pd/Au plated copper
Applications
- For Automotive
- For Electronic Device
- Applicable Packages: TSOP, SOP, QFP, QFN, DIP, TO, High-Voltage Diode
| Applicable Packages | |||
|---|---|---|---|
| TSOP,SOP,QFP | QFN | TO252,TO220 | |
| Feature | High adhesion strength Low water absorption |
Good warpage, High adhesion to PPF |
High adhesive strength, Low modulus for good MSL performance |
| Recommended product | KE-G3000D series* | KE-G3000N series | KE-G3000DM series |
*Low alpha ray type (KE-G3000D) is available.