Epoxy Molding Compounds for SemiconductorsEMC for Power Module

powermodule

Our EMCs for power module have low CTE, low modulus and high glass transition temperature (Tg), and achieve good reliability by reducing the stress that temperature fluctuations cause.

  • Stress Relaxation >>> Warpage Control (CTE, Tg), Low Modulus
  • Moldability >>> Flowability Control, Narrow Gap Filling
  • Heat Resistant >>> High Tg
  • Long-term Reliability >>> High tracking resistance, Low ionic impurities

モジュール用封止材 適用基板種類

For inquiries or requests for information about the chemical products transferred from Kyocera Corporation,
please contact us here.
Email:
KC_chemicalproducts_inquiry@ml.sumibe.co.jp

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