Sumitomo Bakelite Co., Ltd.

Epoxy Molding Compounds for SemiconductorsSheet EMC for PLP/WLP​

1.Flexible, crack-resistant sheet.
2.Suitable for low profile and large packaging, improving productivity.
3.Equivalent reliability to current EMC.

Features

1.Sheet EMC have less resin flow during molding, which reduces molding defects.
2.Compatible with both laminator sealing and compression molding.
Low warpage even in large molding

For inquiries or requests for information about the chemical products transferred from Kyocera Corporation,
please contact us here.
Email：
KC_chemicalproducts_inquiry@ml.sumibe.co.jp

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