Electrical/High Thermal Conductive PasteAg Sintering Paste for Electrodes

Features and Applications of Ag Sintering Paste for Electrodes

Our Ag sintering paste for electrodes achieves lower electrical resistance, lower ESR, and lower contact resistance in the product by utilizing sintering of nano-silver powder. It also adheres to non-metallic surfaces due to its resin composition.

Application Image

Application Example: Metal-Based Power Inductor

Comparison of features with other materials

Type of paste Our product
Ag sintering
Pure Ag sintering Our product
Ag paste
Pb free solder
Composition Nano Ag powder
+Resin
Nano Ag powder
+Solvent
Micro Ag powder
+Resin
Composite metal
+Flux
Adhesion to Metal ++ ++ + ++
Non-Metal ++ - ++ -
Electrical conductivity ++ ++ + ++

Coating method

・Available lineup for dip coating and screen printing
・Customizable viscosity characteristics for required workability

Interface Reliability Test (Trend of inductor resistance change)

・Lower electrical resistance than epoxy silver paste
・Low electrical resistance even after reliability test

For inquiries or requests for information about the chemical products transferred from Kyocera Corporation,
please contact us here.
Email:
KC_chemicalproducts_inquiry@ml.sumibe.co.jp

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FAQ