Electrical/High Thermal Conductive PasteAg Sintering Paste for Die-attach
Features of Ag Sintering Paste
High bonding strength by metal sintering with nano Ag and micron Ag powders
・Low electrical resistance
・High thermal conductivity
・Unique resin dispersion system for
achieving high heat resistance and reliability with low stress (exhibits high bonding reliability
even at 250°C)
Comparison with Conventional Ag Paste
The Bonding Process of Ag Sintering Paste
・Utilization of existing equipment is possible
Pressure-less bonding
Same application method as conventional Ag paste
・Apply low temperature 200-250°C for sintering
・Curing in air or nitrogen atmosphere
Pressure-less bonding
Same application method as conventional Ag paste
・Apply low temperature 200-250°C for sintering
・Curing in air or nitrogen atmosphere
Applications of Silver Sintering Paste
【For Solder Replacement】
・Substitution for high-temperature lead solder
・Substitution for AuSn solder
・Substitution for high-temperature lead solder
・Substitution for AuSn solder
【Devices】
・SiC/GaN power devices (TO packages, power modules)
・Vertical-cavity surface-emitting lasers (VCSEL)br>・High-power LEDs
・SiC/GaN power devices (TO packages, power modules)
・Vertical-cavity surface-emitting lasers (VCSEL)br>・High-power LEDs
Cross-Sectional Observation of the Sintering Layer
Bonding Reliability Test
Shear Strength Change (at 250°C high-temperature exposure)
Test conditions
Die：4.0x4.0x0.3mm
(BM:Au)
LF：Pd-PPF
Measurement temperature：260°C
