Electrification

Inverter Solution（High Thermal Conductive Materials, Special Molding Compound for Electric Part Mounting Circuit Board, Plating Thermoset Composite Integration Technology)
Motor Solution（Molding Compound for Stator Coil Encapsulation, High Dimensional Accuracy Phenolic Molding Compound "SiON™"）

Advanced Driver-Assistance Systems

High-speed Communication Solution (High Dielectric Molding Materials for 5G・Millimeter Wave Antenna, Innovative Interposer Material for Semiconductor Package “LαZ^®”)
Sencing Solution（High Tear Strength Silicone Rubber DuraQ^®, Wavelength Selective Barrier Sheet)